805933215@qq.com    +86 18922952082
enLanguage
Cont

Have any Questions?

+86 18922952082

Mar 24, 2023

Main Factors Affecting The Distribution Of Gold Plating Layer On Connectors

The effects of the base shape of the contact body in the connector, the electroplating power supply, the electroplating method and the loading amount of the plated parts on the distribution of the gold-plated layer on the surface of the plated part were analyzed. It is concluded that choosing a lower current density, an appropriate plating load, using a bidirectional pulse power supply and a new type of roller or vibrating device, and adopting different processes for different structures of contacts can promote the gold plating of connector contacts. Uniform distribution of layers.

The uniformity of the distribution of the metal coating on the cathode is an important factor determining the quality of the coating. In electroplating production, people always hope to obtain a uniform coating on the surface of the plated part. Since the functional part of the socket contact in the connector is the inner surface of the socket, if the coating on the inner and outer surfaces of the plated part can be uniformly distributed, the production cost can be minimized. But in fact, no matter what kind of electroplating solution is used, there is always a phenomenon of uneven thickness of the coating. According to Faraday's law, during the electroplating process, when the current passes through the electroplating solution (electrolyte solution), the amount of precipitated substances on the cathode is proportional to the electricity passing through. From this point of view, the distribution of the coating on the surface of the part depends on the distribution of the current on the surface of the cathode, so all factors that affect the distribution of the current on the surface of the cathode affect the distribution of the coating on the surface of the cathode.

In addition, during the electroplating process, the reaction on the cathode is often not simple metal precipitation, and often accompanied by metal precipitation, hydrogen evolution reaction or other side reactions often occur, which shows that the coating distribution is also affected by the properties of the solution. At the same time There is also the issue of current efficiency. In the daily production of gold-plated contacts, the uniformity of the coating on the cathode is not only related to the properties of the solution, but also related to the shape of the plated part, the choice of electroplating method, the choice of electroplating power supply, the choice of current density range and the quality of the plated part. Loading and other factors are closely related.

Send Inquiry